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BLIIoT BL302

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bl18

NVIDIA Jetson Orin Nano Industrial AI Edge Computer EA230Pro

Name: NVIDIA Jetson Orin Nano Industrial AI Edge Computer EA230Pro
Brand: Beilai Tech. Co., Ltd.
SKU: EA230Pro

No.EA230Pro

EA230Pro: rugged industrial edge AI computer with NVIDIA Jetson Orin Nano, up to 67 TOPS INT8, modular 4× GbE / GMSL2 / MIPI CSI-2 camera inputs, Y-series IO expansion, isolated RS-485/CAN-FD, 12–24V wide input, -20 to +75°C.

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Description
Model Selection

NVIDIA® Jetson Orin™ Nano Platform

Industrial Edge AI,
modular by design

EA230Pro packs up to 67 TOPS of INT8 AI performance into a rugged, scalable industrial computer. Choose from four Gigabit Ethernet, four GMSL2 or four MIPI CSI-2 camera inputs, and extend I/O with Y-series modules — all on-site, in real time.

67 TOPSINT8 AI

4× CameraGbE / GMSL2 / CSI-2

-20 / +75 °COperating

12–24 VWide DC Input

Why EA230Pro

Built for systems that need more than one camera

Six reasons engineers choose the Pro platform for multi-sensor, multi-bus edge AI.

Up to 67 TOPS, right where the cameras are

Run YOLO detection, segmentation, pose estimation or a lightweight LLM/VLM entirely on-device. No cloud latency, no bandwidth cost, no sensitive footage leaving the site.

1024 CUDA cores · 32 Tensor Cores · 7–15 W typical

Four camera inputs, three ways to connect

Pick the interface that matches your sensors: four additional Gigabit Ethernet ports, four GMSL2 deserializers with PoC over FAKRA Z, or four MIPI CSI-2 channels via 22-pin FFC. One module at a time, so you only pay for what you need.

VD01: 4× 1GbE · VD03: 4× GMSL2 · VD05: 4× MIPI CSI-2

Y-series IO: scale from 4 to 30+ channels

A dedicated Y-slot accepts digital, analog, RTD, thermocouple, RS-485/232, CAN-FD and PWM modules. Build exactly the I/O your machine needs — up to 2× CAN-FD, 4× RS-485, 16× DI, 8× DO, plus GPI/GPO.

Y01–Y96 modules · 16 DI / 8 DO / 4 AI / 4 AO / RTD / TC / PWM

Rugged enough for the cabinet, not just the desk

An all-aluminium chassis with passive cooling and an optional speed-controlled fan, rated from -20 °C to +75 °C, fed by a 12–24 V wide DC input. Immunity tested to EMC level III: ESD ±6/±8 kV, EFT, surge, voltage dips and 30 A/m magnetic fields.

IP30 · CE / FCC · Optional fan kit

Modular from camera to cloud

Storage, wireless and security are all field-replaceable: M.2 Key-M for NVMe, M.2 Key-E for Wi-Fi 6/Bluetooth, Mini PCIe for LTE/5G, plus optional firmware TPM 2.0 and out-of-band management.

M.2 Key-M / Key-E · Mini PCIe · fTPM 2.0 · OOB

Service without a site visit

The optional out-of-band module lets you power-cycle or reboot over Ethernet, Wi-Fi or 4G — even when the OS is unresponsive. Perfect for cabinets on a pole, in a tunnel, or hours from the nearest engineer.

OOB power control · Ethernet / Wi-Fi / 4G

Applications

Where EA230Pro is deployed today

Industrial visual inspection

AMR / AGV controllers

Smart traffic roadside perception

Energy storage EMS / BMS

AIoT edge gateways

Solar & substation monitoring

Agriculture & environmental monitoring

Industrial predictive maintenance

Specifications

Core specifications

System block diagram

Core hardware parameters

CPU	NVIDIA® Jetson Orin™ Nano — 6-core Arm Cortex-A78AE, up to 1.7 GHz
GPU	1024 CUDA cores + 32 Tensor Cores (4th generation)
AI performance	Up to 67 TOPS (INT8) with the 8 GB module / up to 34 TOPS with the 4 GB module
Memory	4 GB or 8 GB LPDDR5
Video encode	1080p30, supports 1–2 CPU cores
Video decode	1× 8K30 / 2× 4K60 / 4× 4K30 / 9× 1080p60 (H.265)
Ethernet	2× RJ-45: 1× 1 Gb + 1× 2.5 Gb auto-negotiating; ESD level 3, EFT level 3
USB	2× USB 2.0 Type-A (480 Mbps) · 4× USB 3.1 Gen1 Type-A (5 Gbps)
Display	1× HDMI 2.1, up to 8K@30 Hz
Audio	1× audio out (headphone/line); APE and HDA support; I2S digital audio interface
Storage	1× M.2 Key-M (2280) with PCIe Gen3 x1 for NVMe SSD
Wireless expansion	1× M.2 Key-E (2230) for Wi-Fi 6 / Bluetooth, supporting PCIe, USB and UARTModule sold separately
Cellular	1× Mini PCIe for LTE/5G modem or Wi-Fi, USB 2.0 only — 4G and Wi-Fi are mutually exclusive
Security	Firmware-based TPM 2.0 (fTPM), compliant with the TPM 2.0 standard
Digital I/O	2× isolated GPI (5 V level) · 2× isolated GPO (5 V level)
Serial	1× isolated RS-485, pin-multiplexed with RS-232 (RS-485 by default, RS-232 on request) · 1× isolated CAN-FD
IO expansion	1× Y-board interface; up to 2× CAN-FD, 4× RS-485, 16× DI, 8× DO, 2× GPI and 2× GPO
Camera input module	Choose one: VD01 (4× 1GbE RJ45) · VD03 (4× GMSL2, FAKRA Z, PoC) · VD05 (4× MIPI CSI-2 via 2× 22-pin FFC, Jetson Orin DevKit pinout)VD05: uncased design
Out-of-band	Optional OOB management module with its own Ethernet, Wi-Fi and 4G interfaces (Mini PCIe, USB only)
Power input	12–24 V wide DC input via 2-pin terminal block
Operating temp.	-20 °C to +75 °C
Storage temp.	-40 °C to +85 °C
Dimensions	Standard: 166 × 107.6 × 67 mm · With fan: 166 × 107.6 × 74.6 mm
Cooling	Passive or active; externally speed-controlled fan for enhanced cooling (optional)
Mounting	Bracket mounting, aluminium alloy enclosure
Certification	CE, FCC

Support

Development resources & services

Development resources

System image and root file system image
Kernel driver source code
Complete platform SDK
Getting-started guides and a library of demo programs

Value-added services

Second-development assistance
Custom R&D and manufacturing
Long-term after-sales support

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