EA230Pro packs up to 67 TOPS of INT8 AI performance into a rugged, scalable industrial computer. Choose from four Gigabit Ethernet, four GMSL2 or four MIPI CSI-2 camera inputs, and extend I/O with Y-series modules — all on-site, in real time.
Six reasons engineers choose the Pro platform for multi-sensor, multi-bus edge AI.
Run YOLO detection, segmentation, pose estimation or a lightweight LLM/VLM entirely on-device. No cloud latency, no bandwidth cost, no sensitive footage leaving the site.
1024 CUDA cores · 32 Tensor Cores · 7–15 W typicalPick the interface that matches your sensors: four additional Gigabit Ethernet ports, four GMSL2 deserializers with PoC over FAKRA Z, or four MIPI CSI-2 channels via 22-pin FFC. One module at a time, so you only pay for what you need.
VD01: 4× 1GbE · VD03: 4× GMSL2 · VD05: 4× MIPI CSI-2A dedicated Y-slot accepts digital, analog, RTD, thermocouple, RS-485/232, CAN-FD and PWM modules. Build exactly the I/O your machine needs — up to 2× CAN-FD, 4× RS-485, 16× DI, 8× DO, plus GPI/GPO.
Y01–Y96 modules · 16 DI / 8 DO / 4 AI / 4 AO / RTD / TC / PWMAn all-aluminium chassis with passive cooling and an optional speed-controlled fan, rated from -20 °C to +75 °C, fed by a 12–24 V wide DC input. Immunity tested to EMC level III: ESD ±6/±8 kV, EFT, surge, voltage dips and 30 A/m magnetic fields.
IP30 · CE / FCC · Optional fan kitStorage, wireless and security are all field-replaceable: M.2 Key-M for NVMe, M.2 Key-E for Wi-Fi 6/Bluetooth, Mini PCIe for LTE/5G, plus optional firmware TPM 2.0 and out-of-band management.
M.2 Key-M / Key-E · Mini PCIe · fTPM 2.0 · OOBThe optional out-of-band module lets you power-cycle or reboot over Ethernet, Wi-Fi or 4G — even when the OS is unresponsive. Perfect for cabinets on a pole, in a tunnel, or hours from the nearest engineer.
OOB power control · Ethernet / Wi-Fi / 4G| CPU | NVIDIA® Jetson Orin™ Nano — 6-core Arm Cortex-A78AE, up to 1.7 GHz |
| GPU | 1024 CUDA cores + 32 Tensor Cores (4th generation) |
| AI performance | Up to 67 TOPS (INT8) with the 8 GB module / up to 34 TOPS with the 4 GB module |
| Memory | 4 GB or 8 GB LPDDR5 |
| Video encode | 1080p30, supports 1–2 CPU cores |
| Video decode | 1× 8K30 / 2× 4K60 / 4× 4K30 / 9× 1080p60 (H.265) |
| Ethernet | 2× RJ-45: 1× 1 Gb + 1× 2.5 Gb auto-negotiating; ESD level 3, EFT level 3 |
| USB | 2× USB 2.0 Type-A (480 Mbps) · 4× USB 3.1 Gen1 Type-A (5 Gbps) |
| Display | 1× HDMI 2.1, up to 8K@30 Hz |
| Audio | 1× audio out (headphone/line); APE and HDA support; I2S digital audio interface |
| Storage | 1× M.2 Key-M (2280) with PCIe Gen3 x1 for NVMe SSD |
| Wireless expansion | 1× M.2 Key-E (2230) for Wi-Fi 6 / Bluetooth, supporting PCIe, USB and UARTModule sold separately |
| Cellular | 1× Mini PCIe for LTE/5G modem or Wi-Fi, USB 2.0 only — 4G and Wi-Fi are mutually exclusive |
| Security | Firmware-based TPM 2.0 (fTPM), compliant with the TPM 2.0 standard |
| Digital I/O | 2× isolated GPI (5 V level) · 2× isolated GPO (5 V level) |
| Serial | 1× isolated RS-485, pin-multiplexed with RS-232 (RS-485 by default, RS-232 on request) · 1× isolated CAN-FD |
| IO expansion | 1× Y-board interface; up to 2× CAN-FD, 4× RS-485, 16× DI, 8× DO, 2× GPI and 2× GPO |
| Camera input module | Choose one: VD01 (4× 1GbE RJ45) · VD03 (4× GMSL2, FAKRA Z, PoC) · VD05 (4× MIPI CSI-2 via 2× 22-pin FFC, Jetson Orin DevKit pinout)VD05: uncased design |
| Out-of-band | Optional OOB management module with its own Ethernet, Wi-Fi and 4G interfaces (Mini PCIe, USB only) |
| Power input | 12–24 V wide DC input via 2-pin terminal block |
| Operating temp. | -20 °C to +75 °C |
| Storage temp. | -40 °C to +85 °C |
| Dimensions | Standard: 166 × 107.6 × 67 mm · With fan: 166 × 107.6 × 74.6 mm |
| Cooling | Passive or active; externally speed-controlled fan for enhanced cooling (optional) |
| Mounting | Bracket mounting, aluminium alloy enclosure |
| Certification | CE, FCC |
